신제품

Everspin Technologies SC 계열은 기존 소켓 메모리를 바로 교체할 수 있는 드롭인 제품으로, 원활한 업그레이드가 가능하며 시스템 성능과 안정성도 향상됩니다.

EverSpin's 24-ball BGA MRAM packages.

The EMxxLXB is the industry’s first xSPI serial interface persistent memory based on Everspin’s unique industrial STT MRAM technology.

The Highest Performing Persistent Memory in the Industry.

MikroElektronika의 MIKROE-2914 MRAM click Board™는 Everspin Technologies의 MR25H256, 256Kb 직렬 SPI MRAM 메모리 모듈을 사용합니다.

Five Amazon Echo Dots will be given away at Embedded World 2018 to qualified customers

EverSpin's alternative format for trace codes.

Replacing the Cypress CY14B104NA-BA/ZS45XI nvSRAM with Everspin’s MR2A16Axxx35 MRAM.

Everspin's 48-ball BGA MRAM packages.

Comparing technologies: MRAM vs. FRAM from EverSpin.

EverSpin's TSOP2 MRAM package guide.

EverSpin's MRAM DFN package guide.

EverSpin's SOIC MRAM package guide.

A look at combining FPGA technology with embedded processors including monolithic approaches, SoC solutions, tack-ups, and modules.

Designers working with microcontrollers (MCUs) have come to rely heavily on flash memory for code storage because IC makers have scaled the manufacturing processes for the nonvolatile memory and are producing quite large flash arrays on MCU ICs.

Everspin Technologies는 자기 기반 메모리(MRAM) 및 센서를 개발하고 제조하는 세계적인 선도업체입니다.

Replacing the Cypress CY14B104LA-ZS/BA45xxx nvSRAM with Everspin’s MR2A08AxYS/MA35xxx MRAM.

To increase production capacity and improve flexibility in manufacturing Everspin will qualify nine additional products for assembly in TSOP-44 packages at ASE group.

EverSpin’s 2mm exposed pad DFN package meets both SOIC-8 and DFN8 PCB layouts.

Toggle and spin-torque MRAM status and outlook from EverSpin.