Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Alloy Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Alloy Top Mount
V2022B
V2022B

V2022B

DigiKey Part Number
AE11372-ND
Manufacturer
Assmann WSW Components
Manufacturer Product Number
V2022B
Description
HEATSINK CPU XCUT
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Alloy Top Mount
Datasheet
 Datasheet
EDA/CAD Models
V2022B Models
Product Attributes
Type
Description
Select All
Category
Mfr
Assmann WSW Components
Series
-
Packaging
Bulk
Part Status
Active
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.827" (21.00mm)
Width
0.827" (21.00mm)
Diameter
-
Fin Height
0.236" (6.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
24.00°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 1,282
Check for Additional Incoming Stock
Quantity
All prices are in KRW
Bulk
QuantityUnit PriceExt Price
1₩1,375.00000₩1,375
10₩1,215.40000₩12,154
25₩1,157.68000₩28,942
50₩1,115.68000₩55,784
100₩1,075.37000₩107,537
300₩1,014.51667₩304,355
600₩977.83667₩586,702
1,200₩942.47000₩1,130,964
5,100₩872.59804₩4,450,250
Manufacturers Standard Package
You May Also Be Interested InSee All
6 Items
V2017B

V2017B

HEATSINK ANOD ALUM CPU

Assmann WSW Components

₩1,035.00000
HSB31-212105

HSB31-212105

HEAT SINK, BGA, 21 X 21 X 5 MM

Same Sky (Formerly CUI Devices)

₩1,375.00000
HSB08-212106

HSB08-212106

HEAT SINK, BGA, 21 X 21 X 6 MM

Same Sky (Formerly CUI Devices)

₩1,498.00000
V2016B

V2016B

HEATSINK CPU XCUT

Assmann WSW Components

₩757.00000
HSB06-181810

HSB06-181810

HEAT SINK, BGA, 18 X 18 X 10 MM

Same Sky (Formerly CUI Devices)

₩1,792.00000
HSB18-232310

HSB18-232310

HEAT SINK, BGA, 23 X 23 X 10 MM

Same Sky (Formerly CUI Devices)

₩1,745.00000