T Series High Thermal Conductivity Gap PadShiu Li Technology offers LiPOLY's T series high thermal conductivity gap pad is designed for applications including between CPU/components and heatsinks.
N Series Non-Silicone High Thermal Conductivity Gap PadShiu Li Technology's N series non-silicone thermal conductivity gap pad is designed for applications including HDDS, optical appliances, EVs, and more.
THERM-A-GAP PAD 80 Thermally-Conductive Gap Filler PadsParker Chomerics' THERM-A-GAP PAD 80 is a 8.3 W/m-K high-performance, thermally-conductive gap filler pad.
Thermal products are used for various methods of heat transfer. Items in this category include thermal adhesives, thermal epoxies, thermal greases, thermal pastes, heat pipes, vapor chambers, heat sinks, liquid cooling and heating, thermal pads, thermal sheets, thermoelectric products, peltier assemblies, peltier modules, and more.