Adhesives, Epoxies, Greases, Pastes

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of 656

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature
TC3-1G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	287 In Stock	1 : ₩8,818.00000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	1 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
CW7270 HEAT SINK GREASE SILICONE FREE Chemtronics	361 In Stock	1 : ₩23,727.00000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	7 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	0.71W/m-K	-	60 Months	-
9460TC-3ML THERMALLY CONDUCTIVE 1-PART EPOX MG Chemicals	146 In Stock	1 : ₩34,901.00000 Bulk	9460TC	Bulk	Active	Epoxy Adhesive	3 ml Syringe	-85°F ~ 302°F (-65°C ~ 150°C)	White	0.80W/m-K	-	14 Months	50°F ~ 86°F (10°C ~ 30°C)
8329TCS-6ML ADHESIVE - THERMAL CONDUCTIVE EP MG Chemicals	108 In Stock	1 : ₩47,913.00000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	6 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
TC3-10G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	442 In Stock	1 : ₩56,242.00000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	5cc Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
65-00-GEL75-0010 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	147 In Stock	1 : ₩70,588.00000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	10cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
TG-N8000-30 NON-SILICONE PUTTY 30G POT YELLO t-Global Technology	65 In Stock	1 : ₩74,396.00000 Bulk	TG-N8000	Bulk	Active	Non-Silicone Putty	30 gram Jar	-40°C ~ 125°C	Yellow	8.00W/m-K	-	12 Months	-
65-02-GEL75-0030 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	197 In Stock	1 : ₩94,418.00000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	30cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
8329TFS-50ML SLOW CURE THERM COND ADH FLOW MG Chemicals	51 In Stock	1 : ₩97,901.00000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	45 ml Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
CW7100 CONDUCTIVE SILVER GREASE SYRINGE Chemtronics	397 In Stock	1 : ₩100,806.00000 Bulk	CircuitWorks®	Bulk	Active	Silicone Grease	6.5 gram Syringe	-70°F ~ 485°F (-57°C ~ 252°C)	Silver	5.60W/m-K	-	120 Months	-
1978-1 SILICONE FREE HEAT SINK Techspray	144 In Stock	1 : ₩121,065.00000 Bulk	-	Bulk	Active	Non-Silicone Compound	1 lb Can	-	Gray	-	-	60 Months	Ambient Temperature
A17170-02 TPUTTY 508 Laird Technologies - Thermal Materials	75 In Stock	1 : ₩165,495.00000 Box	Tputty™ 508	Box	Active	Silicone Compound	180cc Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Green	3.70W/m-K	Low Outgassing (ASTM E595)	6 Months	-
127-20-10 GREASE 1GRAM SYRINGE 20W/M-K NON Wakefield-Vette	59 In Stock	1 : ₩214,697.00000 Bulk	127	Bulk	Active	Non-Silicone Grease	1 gram Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	Gray	20.00W/m-K	-	29 Months	-
1188118 STYCAST 2850FT BLK 3# 1.36KG LOCTITE	183 In Stock	1 : ₩233,593.00000 Bulk	LOCTITE® Stycast 2850FT	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	1.36 kg Container	-85°F ~ 221°F (-65°C ~ 105°C)	Black	-	-	18 Months	64.4°F ~ 77°F (18°C ~ 25°C)
1188119 STYCAST 2850FT BLK18# 8.16KG LOCTITE	146 In Stock	1 : ₩448,409.00000 Bulk	LOCTITE® Stycast 2850FT	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	8.16 kg Container	-85°F ~ 221°F (-65°C ~ 105°C)	Black	-	-	18 Months	64.4°F ~ 77°F (18°C ~ 25°C)
GF3500S35-00-60-400CC LIQUID GAP FILLER THERMAL CONDUC Bergquist	54 In Stock	1 : ₩486,126.00000 Bulk	Gap Filler 3500S35	Bulk	Active	Liquid Gap Filler, 2 Part	400cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Blue	3.60W/m-K	-	5 Months	77°F (25°C)
TC1-20G HEAT SINK COMPOUND - HIGH DENSIT Chip Quik Inc.	146 In Stock	1 : ₩19,192.00000 Bulk	-	Bulk	Active	Silicone Compound	20 gram Syringe	-	White	0.67W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
A16872-03 TPUTTY 403 180CC CARTRIDGE Laird Technologies - Thermal Materials	61 In Stock	1 : ₩185,576.00000 Bulk	Tputty™ 403	Bulk	Active	Liquid Gap Filler	180cc Cartridge	-49°F ~ 302°F (-45°C ~ 150°C)	White	2.30W/m-K	Low Outgassing (ASTM E595)	24 Months	-
127-12-10 GREASE 1 GRAM SYRINGE 12W/M-K Wakefield-Vette	36 In Stock	1 : ₩205,983.00000 Bulk	127	Bulk	Active	Non-Silicone Grease	1 gram Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	Gray	12.00W/m-K	-	29 Months	-
A18560-09 TPUTTY 910 - 30CC CARTRIDGE Laird Technologies - Thermal Materials	26 In Stock	1 : ₩208,562.00000 Box	Tputty™ 910	Box	Active	Liquid Gap Filler	30cc Cartridge	-40°F ~ 356°F (-40°C ~ 180°C)	Red	9.10W/m-K	-	-	-
65-00-GREASE15-0010 THERM-A-GREASE 1.5 W/MK 10CC SYR Parker Chomerics	153 In Stock	1 : ₩25,194.00000 Bulk	THERM-A-GREASE 15	Bulk	Active	Silicone Grease	10cc Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	White	1.50W/m-K	Low Outgassing (ASTM E595)	12 Months	50°F ~ 90°F (10°C ~ 32.22°C)
65-00-GREASE30-0010 THERM-A-GREASE 3.0W/MK 10CC SYR Parker Chomerics	127 In Stock	1 : ₩26,498.00000 Bulk	THERM-A-GREASE 30	Bulk	Active	Silicone Grease	10cc Syringe	-58°F ~ 392°F (-50°C ~ 200°C)	White	3.00W/m-K	Low Outgassing (ASTM E595)	12 Months	50°F ~ 90°F (10°C ~ 32.22°C)
CS-D4000 4 W/MK thermal grease Cooling Source	19,872 Marketplace	1 : ₩9,904.00000 Bulk	-	Bulk	Active	-	-	-	-	-	-	-	-
X-PUTTY-100 THERMAL PUTTY 100G, GRAY COLOR, Shiu Li Technology Co., Ltd.	114 In Stock	1 : ₩41,629.00000 Retail Package	LiPOLY® X-putty	Retail Package	Active	Silicone Putty	100 gram Cartridge	-76°F ~ 356°F (-60°C ~ 180°C)	Gray	3.00W/m-K	-	60 Months	41°F ~ 95°F (5°C ~ 35°C)
SILV5-THERMAL-PASTE THERMAL PASTE, PACK OF 5 SYRINGE StarTech.com	375 In Stock	1 : ₩47,898.00000 Bag	-	Bag	Active	Silicone Compound	1.5 gram Syringe	-22°F ~ 365°F (-30°C ~ 180°C)	-	3.20W/m-K	-	24 Months	-22°F ~ 365°F (-30°C ~ 180°C)

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Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.