Adhesives, Epoxies, Greases, Pastes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature
TC3-1G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	1,146 In Stock	1 : ₩8,942.00000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	1 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
TC1-10G HEAT SINK COMPOUND - HIGH DENSIT Chip Quik Inc.	407 In Stock	1 : ₩13,450.00000 Bulk	-	Bulk	Active	Silicone Compound	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	White	0.67W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
250G THERMALCOTE GREASE TUBE 2OZ Boyd Laconia, LLC	778 In Stock	1 : ₩20,393.00000 Bulk	Thermalcote™	Bulk	Active	Silicone Compound	2 oz Tube	-40°F ~ 399°F (-40°C ~ 204°C)	White	0.76W/m-K	-	Indefinite (Unopened)	-
TG-N909-30 NON-SILICONE THERMAL GREASE 30G t-Global Technology	603 In Stock	1 : ₩22,271.00000 Bulk	TG-N909	Bulk	Active	Non-Silicone Grease	30 gram Container	-40°F ~ 392°F (-40°C ~ 200°C)	Gray	9.00W/m-K	Low Outgassing (ASTM E595)	18 Months	77°F (25°C) or Below
CW7270 HEAT SINK GREASE SILICONE FREE Chemtronics	715 In Stock	1 : ₩25,908.00000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	7 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	0.71W/m-K	-	60 Months	-
CW7250 HEAT SINK GREASE BORON NITRIDE Chemtronics	446 In Stock	1 : ₩33,738.00000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	3.4 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	1.85W/m-K	-	60 Months	-
GF1000-00-15-50CC GF1000 50CC DUAL CARTRIDGE Bergquist	296 In Stock	1 : ₩38,216.00000 Box	Gap Filler 1000	Box	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 347°F (-60°C ~ 175°C)	Gray	1.00W/m-K	-	6 Months	77°F (25°C)
846-80G GREASE CARBON ELEC CONDUCT 2.8OZ MG Chemicals	101 In Stock	1 : ₩49,412.00000 Bulk	-	Bulk	Active	Silicone Grease	2.8 oz Container	-58°F ~ 392°F (-50°C ~ 200°C)	Black	-	Odorless	60 Months	50°F ~ 86°F (10°C ~ 30°C)
GF1500-00-60-50CC GF1500 50CC DUAL CARTRIDGE Bergquist	758 In Stock	1 : ₩52,207.00000 Box	Gap Filler 1500	Box	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Yellow	1.80W/m-K	-	6 Months	77°F (25°C)
CT40-5 SILICONE GREASE 5 0Z TUBE Chemtronics	1,406 In Stock	1 : ₩52,703.00000 Bulk	CircuitWorks®	Bulk	Active	Silicone Compound	5 oz Tube	5°F ~ 392°F (-15°C ~ 200°C)	White	0.63W/m-K	-	60 Months	-
8329TCS-6ML ADHESIVE - THERMAL CONDUCTIVE EP MG Chemicals	583 In Stock	1 : ₩52,929.00000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	6 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
1978-DP SILICONE FREE HEAT SINK COMP. Techspray	834 In Stock	1 : ₩56,115.00000 Bulk	-	Bulk	Active	Non-Silicone Compound	4 oz Tube	-	Gray	-	-	60 Months	Ambient Temperature
TC3-10G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	269 In Stock	1 : ₩57,031.00000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	5cc Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
65-02-GEL35VT-0030 THERM-A-GAP GEL35VT 3.5W/MK 30CC Parker Chomerics	131 In Stock	1 : ₩66,033.00000 Box	THERM-A-GAP™ GEL 35VT	Box	Active	Silicone Gel	30cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	3.50W/m-K	Low Outgassing (ASTM E595)	24 Months	50°F ~ 90°F (10°C ~ 32.22°C)
8329TFS-25ML SLOW CURE THERM COND ADH FLOW MG Chemicals	184 In Stock	1 : ₩75,185.00000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	25 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
TC2-20G HEAT SINK COMPOUND - GREY ULTRA Chip Quik Inc.	100 In Stock	1 : ₩78,070.00000 Bulk	-	Bulk	Active	Silicone Compound	20 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	4.30W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
GF3500S35-00-60-50CC GF3500S35 50CC DUAL CARTRIDGE Bergquist	1,433 In Stock	1 : ₩81,091.00000 Box	Gap Filler 3500S35	Box	Active	Liquid Gap Filler, 2 Part	50cc Cartridge	-76°F ~ 392°F (-60°C ~ 200°C)	Blue	3.60W/m-K	-	5 Months	77°F (25°C)
A18835-01 TFLEX CR550 - 2X25CC SIDE-BY-SID Laird Technologies - Thermal Materials	81 In Stock	1 : ₩82,489.00000 Box	Tflex™ CR550	Box	Active	Liquid Gap Filler	50cc Cartridge	-40°F ~ 392°F (-40°C ~ 200°C)	Blue	5.40W/m-K	-	6 Months	-
65-02-GEL50VT-0030 THERM-A-GAP GEL50VT 5.2W/MK30CC Parker Chomerics	32 In Stock	1 : ₩83,586.00000 Box	THERM-A-GAP™ GEL 50VT	Box	Active	Silicone Gel	30cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	Gray	5.20W/m-K	Low Outgassing (ASTM E595)	12 Months	50°F ~ 90°F (10°C ~ 32.22°C)
A17170-01 TPUTTY 508 Laird Technologies - Thermal Materials	29 In Stock	1 : ₩89,702.00000 Box	Tputty™ 508	Box	Active	Silicone Compound	75cc Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Green	3.70W/m-K	Low Outgassing (ASTM E595)	6 Months	-
65-00-GEL75-0010 THERM-A-GAP GEL 75 7.5 W/M-K DIS Parker Chomerics	865 In Stock	1 : ₩91,686.00000 Bottle	THERM-A-GAP™ GEL 75	Bottle	Active	Silicone Gel	10cc Syringe	-67°F ~ 392°F (-55°C ~ 200°C)	White	7.50W/m-K	Low Outgassing (ASTM E595)	18 Months	50°F ~ 90°F (10°C ~ 32.22°C)
8329TFS-50ML SLOW CURE THERM COND ADH FLOW MG Chemicals	117 In Stock	1 : ₩107,225.00000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	45 ml Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
8329TCS-50ML EPOXY MG Chemicals	45 In Stock	1 : ₩111,523.00000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	50 ml Jar	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
TC4-20G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	151 In Stock	1 : ₩114,408.00000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	20 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
CW7100 CONDUCTIVE SILVER GREASE SYRINGE Chemtronics	449 In Stock	1 : ₩115,235.00000 Bulk	CircuitWorks®	Bulk	Active	Silicone Grease	6.5 gram Syringe	-70°F ~ 485°F (-57°C ~ 252°C)	Silver	5.60W/m-K	-	120 Months	-

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Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.