Heat Sink BGA Aluminum Alloy 3.7W @ 75°C Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Heat Sink BGA Aluminum Alloy 3.7W @ 75°C Top Mount
How to Select a Heat Sink

HSB18-232310

DigiKey Part Number
2223-HSB18-232310-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB18-232310
Description
HEAT SINK, BGA, 23 X 23 X 10 MM
Manufacturer Standard Lead Time
12 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 3.7W @ 75°C Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.906" (23.00mm)
Width
0.906" (23.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
3.7W @ 75°C
Thermal Resistance @ Forced Air Flow
6.80°C/W @ 200 LFM
Thermal Resistance @ Natural
20.41°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 2,682
Check for Additional Incoming Stock
Quantity
All prices are in KRW
Box
QuantityUnit PriceExt Price
1₩1,745.00000₩1,745
10₩1,539.80000₩15,398
25₩1,467.20000₩36,680
50₩1,414.36000₩70,718
150₩1,334.26000₩200,139
300₩1,286.07333₩385,822
600₩1,239.53500₩743,721
1,050₩1,203.20571₩1,263,366
5,100₩1,106.08118₩5,641,014
Manufacturers Standard Package
You May Also Be Interested InSee All
10 Items
TG-T1000-23-23-0.25-5PT

TG-T1000-23-23-0.25-5PT

THERM TAPE 23MMX23MM W/ADH WHT

t-Global Technology

₩463.00000
HSB32-232318

HSB32-232318

HEAT SINK, BGA, 23 X 23 X 18 MM,

Same Sky (Formerly CUI Devices)

₩2,239.00000
HSB23-232325

HSB23-232325

HEAT SINK, BGA, 23 X 23 X 25 MM

Same Sky (Formerly CUI Devices)

₩2,641.00000
HSB31-212105

HSB31-212105

HEAT SINK, BGA, 21 X 21 X 5 MM

Same Sky (Formerly CUI Devices)

₩1,375.00000
HSB06-181810

HSB06-181810

HEAT SINK, BGA, 18 X 18 X 10 MM

Same Sky (Formerly CUI Devices)

₩1,792.00000
8810SQ-35(100)

8810SQ-35(100)

THERM PAD 35X35MM W/ADH WHT

3M (TC)

₩2,162.00000
TGH-0170-01

TGH-0170-01

ALUMINIUM HEAT SINK 17X17MM

t-Global Technology

₩3,336.00000
374024B00035G

374024B00035G

HEATSINK BGA 23X23X10MM W/ADH

Boyd Laconia, LLC

₩3,259.00000
374024B00032G

374024B00032G

374024B00032G

Boyd Laconia, LLC

₩1,620.52814
LTN20069

LTN20069

HEAT SINK BGA/PGA 16.5X16.5X8.9

Wakefield Thermal Solutions

₩2,286.00000