HSB38-707025P
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HSB38-707025P

DigiKey Part Number
2223-HSB38-707025P-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB38-707025P
Description
HEAT SINK, BGA, 70 X 70 X 25 MM,
Manufacturer Standard Lead Time
24 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 21.7W @ 75°C Top Mount
Datasheet
 Datasheet
EDA/CAD Models
HSB38-707025P Models
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Push Pin
Shape
Square, Pin Fins
Length
2.756" (70.00mm)
Width
2.756" (70.00mm)
Diameter
-
Fin Height
0.984" (25.00mm)
Power Dissipation @ Temperature Rise
21.7W @ 75°C
Thermal Resistance @ Forced Air Flow
1.20°C/W @ 200 LFM
Thermal Resistance @ Natural
3.45°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
Product Questions and Answers

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In-Stock: 422
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Quantity
All prices are in KRW
Box
QuantityUnit PriceExt Price
1₩11,980.00000₩11,980
10₩10,603.70000₩106,037
25₩10,100.40000₩252,510
84₩9,470.70238₩795,539
168₩9,127.95833₩1,533,497
252₩8,932.98413₩2,251,112
504₩8,609.08532₩4,338,979
1,008₩8,296.58333₩8,362,956
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