Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount
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HSB07-202009

DigiKey Part Number
2223-HSB07-202009-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB07-202009
Description
HEAT SINK, BGA, 20 X 20 X 9 MM
Manufacturer Standard Lead Time
12 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.787" (20.00mm)
Width
0.787" (20.00mm)
Diameter
-
Fin Height
0.354" (9.00mm)
Power Dissipation @ Temperature Rise
3.1W @ 75°C
Thermal Resistance @ Forced Air Flow
8.60°C/W @ 200 LFM
Thermal Resistance @ Natural
24.08°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
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0 In Stock
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Quantity
All prices are in KRW
Box
QuantityUnit PriceExt Price
1₩1,310.00000₩1,310
10₩1,156.50000₩11,565
25₩1,101.12000₩27,528
50₩1,061.68000₩53,084
204₩985.19608₩200,980
408₩949.61520₩387,443
612₩929.38889₩568,786
1,020₩904.49706₩922,587
5,100₩830.22843₩4,234,165
Manufacturers Standard Package
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