Heat Sink BGA Copper Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA42.5002-15P/CU/2.6Y

DigiKey Part Number
4573-MBA42.5002-15P/CU/2.6Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA42.5002-15P/CU/2.6Y
Description
CU HEAT SINK 42.5X42.5X15MM WITH
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
MBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Pin Fins
Length
1.673" (42.50mm)
Width
1.673" (42.50mm)
Diameter
-
Fin Height
0.472" (12.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 25
Check for Additional Incoming Stock
Quantity
All prices are in KRW
Tray
QuantityUnit PriceExt Price
1₩10,854.00000₩10,854
10₩9,613.10000₩96,131
35₩8,994.14286₩314,795
70₩8,668.95714₩606,827
105₩8,484.11429₩890,832
280₩8,052.62500₩2,254,735
525₩7,787.44571₩4,088,409
1,015₩7,518.41281₩7,631,189
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
You May Also Be Interested InSee All
4 Items
MBA40002-12P/CU/2.6BU

MBA40002-12P/CU/2.6BU

CU HEAT SINK 40X40X12MM WITH PIN

Malico Inc.

₩10,274.00000
MBA35002-20P/CU/2.6BU

MBA35002-20P/CU/2.6BU

CU HEAT SINK 35X35X20MM WITH PIN

Malico Inc.

₩9,096.00000
HBH37.5031-10/CU

HBH37.5031-10/CU

CU HEAT SINK 37.5X37.5X10MM WITH

Malico Inc.

₩10,854.00000
MBA25002-13P/CU/2.3BU

MBA25002-13P/CU/2.3BU

CU HEAT SINK 25X25X13MM WITH PIN

Malico Inc.

₩8,500.00000