Heat Sink TO-3 Aluminum 2.0W @ 30°C Board Level
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Heat Sink TO-3 Aluminum 2.0W @ 30°C Board Level
501303B00000G
501303B00000G

501303B00000G

DigiKey Part Number
HS148-ND
Manufacturer
Boyd Laconia, LLC
Manufacturer Product Number
501303B00000G
Description
HEAT SINK TO-3 .500" COMPACT
Manufacturer Standard Lead Time
16 Weeks
Customer Reference
Detailed Description
Heat Sink TO-3 Aluminum 2.0W @ 30°C Board Level
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Boyd Laconia, LLC
Series
-
Packaging
Bag
Part Status
Active
Type
Board Level
Package Cooled
TO-3
Attachment Method
Bolt On
Shape
Rhombus
Length
1.880" (47.75mm)
Width
1.400" (35.56mm)
Diameter
-
Fin Height
0.500" (12.70mm)
Power Dissipation @ Temperature Rise
2.0W @ 30°C
Thermal Resistance @ Forced Air Flow
4.00°C/W @ 300 LFM
Thermal Resistance @ Natural
12.00°C/W
Material
Aluminum
Material Finish
Black Anodized
Base Product Number
501303
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In-Stock: 902
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Quantity
All prices are in KRW
Bag
QuantityUnit PriceExt Price
1₩9,937.00000₩9,937
10₩8,795.20000₩87,952
25₩8,377.84000₩209,446
50₩8,075.42000₩403,771
100₩7,783.27000₩778,327
250₩7,412.96800₩1,853,242
500₩7,144.29600₩3,572,148
1,000₩6,885.05800₩6,885,058
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