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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B60023G | |
|---|---|
DigiKey Part Number | HS522-ND |
Manufacturer | |
Manufacturer Product Number | 374324B60023G |
Description | BGA HEAT SINK |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Bulk | Power Dissipation @ Temperature Rise 1.5W @ 50°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Solder Anchor | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 1,983
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
Quantity
All prices are in KRW
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | ₩5,672.00000 | ₩5,672 |
| 10 | ₩5,016.00000 | ₩50,160 |
| 25 | ₩4,777.80000 | ₩119,445 |
| 50 | ₩4,605.06000 | ₩230,253 |
| 216 | ₩4,260.75000 | ₩920,322 |
| 432 | ₩4,106.49074 | ₩1,774,004 |
| 648 | ₩4,018.80864 | ₩2,604,188 |
| 1,080 | ₩3,910.91111 | ₩4,223,784 |
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