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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 2,483
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
Quantity
All prices are in KRW
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | ₩4,051.00000 | ₩4,051 |
| 10 | ₩3,582.00000 | ₩35,820 |
| 25 | ₩3,411.68000 | ₩85,292 |
| 50 | ₩3,288.76000 | ₩164,438 |
| 100 | ₩3,169.97000 | ₩316,997 |
| 250 | ₩3,019.25600 | ₩754,814 |
| 756 | ₩2,846.68254 | ₩2,152,092 |
| 1,512 | ₩2,743.48810 | ₩4,148,154 |
| 5,292 | ₩2,566.09316 | ₩13,579,765 |
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