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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
HF115AC-0.0055-AC-90 | |
|---|---|
DigiKey Part Number | BER169-ND |
Manufacturer | |
Manufacturer Product Number | HF115AC-0.0055-AC-90 |
Description | THERM PAD 21.84MMX18.79MM W/ADH |
Manufacturer Standard Lead Time | 10 Weeks |
Customer Reference | |
Detailed Description | Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side |
Datasheet | Datasheet |
Product Attributes
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Category | Material Phase Change Compound |
Manufacturer Bergquist | Adhesive Adhesive - One Side |
Series | Backing, Carrier Fiberglass |
Packaging Bulk | Color Gray |
Part Status Active | Thermal Resistivity 0.35°C/W |
Usage TO-218, TO-220, TO-247 | Thermal Conductivity 0.8W/m-K |
Type Pad, Sheet | Shelf Life 12 Months |
Shape Rectangular | Shelf Life Start Date of Manufacture |
Outline 21.84mm x 18.79mm | Base Product Number |
Thickness 0.0055" (0.140mm) |
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In-Stock: 11,728
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Quantity
All prices are in KRW
Bulk
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | ₩1,177.00000 | ₩1,177 |
| 10 | ₩1,044.20000 | ₩10,442 |
| 25 | ₩994.96000 | ₩24,874 |
| 50 | ₩959.16000 | ₩47,958 |
| 100 | ₩924.47000 | ₩92,447 |
| 300 | ₩872.13000 | ₩261,639 |
| 500 | ₩848.79000 | ₩424,395 |
| 1,000 | ₩818.09100 | ₩818,091 |
| 5,000 | ₩777.81680 | ₩3,889,084 |
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