Solder preforms, wire, and ribbon are manufactured and packaged to minimize oxidation. Since no container offers complete isolation from oxygen in ambient air, solder will slowly oxidize, which may result in a reduction in wetting.

The alloys in this book are the result of decades of listening to our customers and finding solutions that enable cutting-edge technologies

Metal Thermal Interface Materials (TIMs) aid in the transfer of heat between surfaces and minimize the thermal resistance at each device connection.

For high-power devices, the performance of interconnect materials within the packaging is critical to achieve efficiency and longevity.

The automotive industry, emerging electric vehicles, and wafer-level packages with smaller pitch sizes demand higher reliability of solder joints, namely, the elongated lifetime and/or the survival of more aggressive service conditions, than the mainstream SAC305.

The theoretical volume of solder paste can be calculated for each board using the Greely Formula and a simple volume calculation.

Durafuse® LT serves as a high-reliability solution to several different application challenges employing a vast array of reflow processes to achieve different results.

Indium metal is extracted primarily from indium-bearing zinc or tin ores and purified to various grades utilizing state-of-the-art statistical process-controlled refining technologies.

Indium flux and solder compatibility application note.

Reducing the energy consumed by the reflow oven has a direct impact on reduced CO2 emissions. In addition to quantifying the energy consumed, there is a growing emphasis on the Life Cycle Assessment (LCA) of a product.

A manufacturer can choose either a rosin-containing or a non-rosin-containing flux based on the solvent used, the ratio of flux to solvent, and the current cleaning process, to name a few.

One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs.

Indium Corporation은 표면 실장 산업의 엄격한 품질 요구 사항을 뛰어넘어 보다 일관되고 안정적인 성능을 제공하는 봉형 땜납을 제조합니다.

Indium Corporation의 고체 납땜 전선은 ASTM B-32, J-STD-006, JIS-Z-3282의 엄격한 품질 기준을 충족하도록 제조되었습니다.

CW-807은 모든 Indium Corporation의 무세척 납땜 페이스트, 웨이브 플럭스 및 일반적인 소프트 납땜 합금과 호환됩니다.

Indium의 봉형 땜납 칩은 소형 용기를 채우거나 새 납땜 용기에서 납땜의 용융 속도를 높이는 데 사용되는 전자 장비용 봉형 땜납의 작은 조각입니다.

Indium의 Indium6.6HF 수용성 납땜 페이스트는 뛰어난 리플로 공정 창을 통해 SnPb 및 무연 조립 공정에 적합합니다.