Lead Free Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 17.64 oz (500g)
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

WS991LT500T4

DigiKey Part Number
315-WS991LT500T4-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
WS991LT500T4
Description
SOLDER PASTE THERMALLY STABLE WS
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free Water Soluble Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Filter Similar Products
Show Empty Attributes
Category
Flux Type
Water Soluble
Manufacturer
Chip Quik Inc.
Mesh Type
4
Series
Process
Lead Free
Packaging
Bulk
Form
Jar, 17.64 oz (500g)
Part Status
Active
Shelf Life
6 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Base Product Number
Melting Point
281°F (138°C)
Report Product Information Error
Documents & Media
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 4
Check for Additional Incoming Stock
Quantity
All prices are in KRW
Bulk
QuantityUnit PriceExt Price
1₩167,671.00000₩167,671
5₩144,474.20000₩722,371
10₩135,474.90000₩1,354,749
25₩124,401.76000₩3,110,044
50₩117,611.88000₩5,880,594
Manufacturers Standard Package
You May Also Be Interested In
1 Items
TS991SNL500T4

TS991SNL500T4

SOLDER PASTE THERMALLY STABLE NC

Chip Quik Inc.

₩170,684.00000
Terms & Conditions Privacy Notice Cookie Settings
Local Support: #1305, 91, Changnyong-daero 256beon-gil, Yeongtong-gu, Suwon-si, Gyeonggi-do, 16229 Copyright © 1995-2026, DigiKey. All Rights Reserved.
ECIA Member
This site is protected by VikingCloud's Trusted Commerce program
ECIA Member