18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
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18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
DILB18P-223TLF
DILB18P-223TLF

DILB18P-223TLF

DigiKey Part Number
609-5427-ND
Manufacturer
Manufacturer Product Number
DILB18P-223TLF
Description
CONN IC DIP SOCKET 18POS TINLEAD
Customer Reference
Detailed Description
18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
Datasheet
 Datasheet
EDA/CAD Models
DILB18P-223TLF Models
Product Attributes
Filter Similar Products
Category
Termination
Solder
Manufacturer
Amphenol ICC (FCI)
Pitch - Post
0.100" (2.54mm)
Series
Contact Finish - Post
Tin-Lead
Packaging
Tube
Contact Finish Thickness - Post
100.0µin (2.54µm)
Part Status
Last Time Buy
Contact Material - Post
Copper Alloy
Type
DIP, 0.3" (7.62mm) Row Spacing
Housing Material
Polyamide (PA), Nylon
Number of Positions or Pins (Grid)
18 (2 x 9)
Operating Temperature
-55°C ~ 125°C
Pitch - Mating
0.100" (2.54mm)
Termination Post Length
0.124" (3.15mm)
Contact Finish - Mating
Tin-Lead
Material Flammability Rating
UL94 V-0
Contact Finish Thickness - Mating
100.0µin (2.54µm)
Current Rating (Amps)
1 A
Contact Material - Mating
Copper Alloy
Contact Resistance
30mOhm
Mounting Type
Through Hole
Base Product Number
Features
Open Frame
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
Substitutes (1)
Part NumberManufacturerQuantity AvailableDigiKey Part NumberUnit PriceSubstitute Type
AR 18-HZL-TTAssmann WSW Components7,185123-AR18-HZL-TT-ND₩1,697.00000Similar
In-Stock: 8,953
Check for Additional Incoming Stock
Last Time Buy Date: 2026. 6. 26.
All prices are in KRW
Tube
QuantityUnit PriceExt Price
1₩1,085.00000₩1,085
10₩918.80000₩9,188
26₩859.07692₩22,336
52₩818.21154₩42,547
104₩779.09615₩81,026
260₩730.17692₩189,846
520₩695.30962₩361,561
1,014₩663.27909₩672,565
2,522₩621.96471₩1,568,595
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.