ELCON Micro Wire-to-Board Power Solutions

TE Connectivity AMP's ELCON Micro wire-to-board power solutions provide a high current up to 12.5 A per pin in the common industry footprint of 3.0 mm. A standard footprint allows for easy upgrades to existing designs and makes the headers and cable plugs footprint-compatible with other suppliers. Custom cable assemblies round out the high-current portfolio and provide design flexibility.

Features

• Provide high current at 12.5 A per pin in the common industry footprint of 3.0 mm (contact pitch)
• Support different currents with multiple combinations of different wire sizes and 2-pin to 24-pin configurations
• A common industry footprint allows for easy upgrades to existing designs
• PCB footprint compatible with other suppliers
• Virtually foolproof mating makes assembly easy
• Perform reliably in harsh environments with a maximum operating temperature of +105°C and halogen-free material
• Cable plugs and custom cable assemblies provide added design flexibility