Tpcm™ 7000 Thermal Pad

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Product Highlights > Tpcm™ 7000 Thermal Pad

            Tpcm™ 7000 Thermal Pad
                    Laird’s 7.5 W/mK enhanced phase change 7000 provides industry-leading low thermal performance
    

Image of Laird Thermal Materials' Tpcm™ 7000 Thermal Pad Laird's Tpcm 7000 offers a thermal conductivity of 7.5 W/mK and is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between +50°C to +70°C, the initial pad thickness can decrease to a bond-line as thin as 35 µm. Coupled with superior wetting of the mating surfaces and displacing air, the Tpcm 7000 provides industry-leading low thermal resistance.