Phase Change - Pressure Increase maxiGRIP™

Phase Change - Pressure Increase maxiGRIP™

Advanced Thermal Solutions Inc

The need to consider interfacial resistance is very important. This tutorial will discuss the thermal interface material (TIMs) performance and usage.

maxiGrip,maxiFlow

이미지제조업체 부품 번호제품 요약주문 가능 수량가격세부 정보 보기
HEAT SINK 17MM X 17MM X 19.5MMATS-51170R-C1-R0HEAT SINK 17MM X 17MM X 19.5MM463 - 즉시$20,368.00세부 정보 보기
HEAT SINK 27MM X 27MM X 9.5MMATS-51270D-C1-R0HEAT SINK 27MM X 27MM X 9.5MM202 - 즉시$22,072.00세부 정보 보기
HEAT SINK 23MM X 23MM X 17.5MMATS-50230P-C1-R0HEAT SINK 23MM X 23MM X 17.5MM300 - 즉시$24,041.00세부 정보 보기
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766663 - 즉시$16,532.00세부 정보 보기
HEAT SINK 19MM X 19MM X 19.5MMATS-51190R-C1-R0HEAT SINK 19MM X 19MM X 19.5MM2609 - 즉시$20,691.00세부 정보 보기
HEAT SINK 27MM X 27MM X 7.5MMATS-50270B-C1-R0HEAT SINK 27MM X 27MM X 7.5MM182 - 즉시$21,029.00세부 정보 보기
HEATSINK 35X35X14.5MM W/OUT TIMATS-51350K-C0-R0HEATSINK 35X35X14.5MM W/OUT TIM141 - 즉시$21,029.00세부 정보 보기
HEAT SINK 31MM X 31MM X 9.5MMATS-51310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MM107 - 즉시$22,792.00세부 정보 보기
HEAT SINK 21MM X 21MM X 14.5MMATS-51210K-C1-R0HEAT SINK 21MM X 21MM X 14.5MM390 - 즉시$22,822.00세부 정보 보기
HEAT SINK 35MM X 35MM X 9.5MMATS-51350D-C1-R0HEAT SINK 35MM X 35MM X 9.5MM216 - 즉시$23,174.00세부 정보 보기
PTM Published on: 2011-10-13

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

게시 날짜: 2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

게시 날짜: 2012-10-15

Related Product Highlight

방열판 부착 솔루션 Advanced Thermal Solutions의 여러 옵션으로 제공되는 방열판 부착 장치를 사용하면 대부분의 방열판을 PCB 기판에 기계적으로 부착할 수 있습니다.
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiGRIP™ Heat Sink Attachment The maxiGRIP system heat sink attachment conforms to standards including Telcordia GR-63-Core, MIL-STD-810, and RoHS compliance.