503159-001 Prod Spec Datasheet by Molex

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molex E 1.5mm E“)?- ififiiifi 3447’}? (1Fllnfi'1) ‘15/09/1 7 T‘AKAIKE
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TITLE: 1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP ST TYPE
製品仕様書
K
変更
REVISED
J2015-1447
15/09/17 T.AKAIKE
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DESIGN CONTROL
J
STATUS
WRITTEN
BY:
N.NISHI
CHECKED
BY:
K.ASAKAWA
APPROVED
BY:
S.ICHIKAWA
DATE: YR/MO/DAY
2008/06/06
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
1 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
【1.適用範囲 SCOPE
本仕様書は、 殿 に納入する
1.5mm ピッチ 電線対基板 ネクタ 1列品 について規定する。
This specification covers the 1.5 mm PITCH WIRE TO BOARD CONNECTOR (SINGLE TYPE) series
【2.製品名称及び型番 PRODUCT NAME AND PART NUMBER
Product Name
Part Number
プラグ ターミナル
Plug Terminal
502579-0*00
503429-0000
プラグ ハウジング(ポジティブロック付き)
Plug Housing (With Positive Lock)
502578-****
ストレート リセ アセンブリ
Straight Receptacle Assembly
503159-****
* : 図面参照 Refer to the drawing.
【3.定格及び適用電線 RATINGS AND APPLICABLE WIRES
Item
Standard
最大許容電圧
Rated Voltage (MAX.)
100 V
[ AC (実効値 rms) / DC ]
適用電線 Applicable wires
502579-0*00AWG#2428
503429-0000AWG#2630
被覆外径 Insulation O.D.
502579-0*00:φ0.78~φ1.28mm
503429-0000:φ0.7~φ1.02mm
最大許容電流 及び 用電線
Rated Current ( MAX. ) and
Applicable wires
AWG#24
2.0A
AWG#26
1.5A
AWG#28
1.0A
AWG#30
1.0A
使用温度範囲
Ambient Temperature Range
(Operating and Non-operating)
-40°C ~ + 105°C*1
低温において氷結しないこと Not freeze to low temperature
*1 : 通電による温度上昇分も含む。 Including terminal temperature rise.
molex flcfixttfii
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TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
2 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
Item
Standard
推奨保管条件
Recommended Storage
condition
温度
Temperature
+5℃~+35
湿度
Humidity
60% R.H. Max.
但し結露しないこと
No condensation permitted.
保管期間
Term of Storage
出荷後6ヶ月(未開封の場合
6 months after the product is stocked.
(unopened package)
molex 4 — 1 .i’fifi‘flflfifi E‘ectrical periormance flcfixttfii
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
3 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
【4.性能 PERFORMANCE
-1.電気的性能 Electrical performance
Item
Test Condition
Requirement
4-1-1
Contact
Resistance
コネクタを嵌合させ、開放電 20mV以下、短絡電流
10mA にて測定する
(JIS C5402 5.4)
Mate connectors and measured by dry circuit,
20mV MAX., 10mA.
(JIS C5402 5.4)
20 milliohms MAX.
4-1-2
Insulation
Resistance
コネクタを嵌合させ、隣接するターミナル間及び
タ-ミナル、アース間に、DC 250Vを印加し測定する
(JIS C5402 5.2/MIL-STD-202 試験法 302)
Mate connectors and apply 250V DC between adjacent
terminal or ground.
(JIS C5402 5.2/MIL-STD-202 Method 302)
500 Megohms MIN.
4-1-3
Dielectric
Strength
コネクタを嵌合させ、隣接するタ-ミナル間及び
タ-ミナル、アース間に、AC(rms) 500V (実効値)
1分間 印加する。感度電 2mA
(JIS C5402 5.1/MIL-STD-202 試験法 301)
Mate connectors and apply 500V AC(rms) for 1 minute
between adjacent terminal or ground. Trip current 2mA.
(JIS C5402 5.1/MIL-STD-202 Method 301)
異状なきこと
No Breakdown
4-1-4
圧着部接触抵抗
Contact
Resistance
on Crimped
Portion
ターミナルに適合電線を圧着し、開放電圧20mV以下、
短絡電流 10mA にて測定する。
Crimp the applicable wire to the terminal, measured by
dry circuit, 20mV MAX., 10mA.
5 milliohms MAX.
molex 4 — 2. wwwmz Mechanical Performance flcfixttfii
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TITLE:
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SINGLE DIP TYPE
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MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
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DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
4 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
-2. 械的性 Mechanical Performance
Item
Test Condition
Requirement
4-2-1
挿入力及び抜去
Insertion and
Withdrawal Force
手挿抜にて挿入、抜去を行う
Insert and withdraw connectors with hand.
第6項参照
Refer to paragraph 6
4-2-2
圧着部引張強度
Crimping
Pull out Force
圧着されたターミナルを治具
固定し、電線を軸方向に
毎分25±3mmの速さで引張る。
(JIS C5402 6.8)
Fix the crimped terminal, apply axial
pull out force on the wire at the speed
rate of 25±3mm/minute.
(JIS C5402 6.8)
AWG#24
29.4N{3.0kgf}MIN.
AWG#26
19.6N{2.0kgf}MIN.
AWG#28
9.8N{1.0kgf}MIN.
AWG#30
4.9N{0.5kgf}MIN.
4-2-3
ターミナル挿入
Terminal Insertion
Force
圧着されたターミナルをハウジングに挿入する。
Insert the crimped terminal into the housing.
9.8N { 1.0kgf } MAX.
4-2-4
プラグターミナ
保持力
Plug Terminal
Retention Force
プラグハウジングに装着されたプラグターミナル
毎分 25±3mmの速さで引張る。
Apply axial pull out force at the speed rate of
25±3mm/minute on the plug terminal assembled
in the plug housing.
9.8N { 1.0kgf } MIN.
4-2-5
リセターミナル
保持力
Rec. Terminal
Retention Force
リセハウジングに装着されたターミナルを
毎分 25±3mm の速さで軸方向に引張る。
Apply axial pull out force at the speed rate of
25±3mm/minute on the rec. terminal assembled
in the rec. housing.
2.94N {0.3 kgf} MIN.
4-2-6
ハウジングロック強度
(ポジティブロック)
Housing Lock
Strength
( Positive Lock )
ハウジングを嵌合し、軸方向に毎分25±3mm
速さで引張る。
Mated connectors, and apply axial pull out force
at the speed rate of 25±3mm/minute.
29.4N {3.0 kgf} MIN.
molex 4 — 3. f 0) 1m Environmental Performance and Others flcfixttfii
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TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
5 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
-3. Environmental Performance and Others
Item
Test Condition
Requirement
4-3-1
寿
Repeated
Insertion /
Withdrawal
1分間 10 以下 の速さで、手挿抜にて
挿入、抜去を30 繰返す。
When mated up to 30 cycles repeatedly by
the rate of 10 cycles per minute with hand.
Contact
Resistance
40 milliohms MAX.
4-3-2
Temperature Rise
全ての圧着端子を最小導体の電線で直列に
接続し定格電圧/電流で熱平衡に達した時の
温度上昇を熱電対で測定する
(但し、抵抗負荷)
All crimp-style terminal shall be connected in
a direct series by minimum AWG.
The temperature rise shall be measured by
thermocouple when the terminal reaches
terminal equilibrium under rated voltage /
rated current. (However with resistive load)
Temperature
Rise
30 °C MAX.
4-3-3
Vibration
DC 1mA 通電状態にて、嵌合軸を含む互い
垂直な3方向に 掃引割合105510 Hz/分、
全振幅 1.52mm の振動を各2時間 える。
(MIL-STD-202 試験法 201)
Mate connectors and subject to the following
vibration conditions, for a period of 2 hours
in each of 3 mutually perpendicular axes,
passing DC 1mA during the test.
Amplitude : 1.52mm P-P
Frequency : 10~55~10 Hz in 1 minute.
Duration : 2 hours in each X.Y.Z.axes.
(MIL-STD-202 Method 201)
Appearance
異状なきこと
No Damage
Contact
Resistance
40 milliohms MAX.
Discontinuity
1 microsecond
MAX.
4-3-4
Mechanical Shock
DC 1mA 通電状態にて、嵌合軸を含む互い
垂直な 6方向 490m/s { 50G }作用時間
11msの衝撃を 3 加える。
(JIS C0041/MIL-STD-202 試験法 213)
Mate connectors and subject to the following
shock conditions. 3 shocks shall be applied
along 3 mutually perpendicular axes, passing
DC 1 mA current during the test.
(Total of 18 shocks)
Test pulse : Half Sine
Peak value : 490 m/s2 (50 G)
Duration : 11 ms
(JIS C0041/MIL-STD-202 Method 213)
Appearance
異状なきこと
No Damage
Contact
Resistance
40 milliohms MAX.
Discontinuity
1 microsecond
MAX.
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TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
6 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-5
Heat Resistance
コネクタを嵌合させ、105±2°C の雰囲気中に
96時間放置後取り出し、1時間室温に
放置する。
(JIS C60068-2-2/MIL-STD-202 試験法 108)
Mate connectors and expose to 105±2 for
96 hours. Upon completion of the exposure
period, the test specimens shall be
conditioned at ambient room conditions for
1 hour , after which the specified
measurements shall be performed.
(JIS C60068-2-2/MIL-STD-202 Method 108)
Appearance
異状なきこと
No Damage
Contact
Resistance
40 milliohms MAX
4-3-6
Cold Resistance
コネクタを嵌合させ、40±3°C の雰囲気中に
96時間 放置後取り出し1時間 室温に
放置する。(JIS C60068-2-1)
Mate connectors and expose to -40±3 for
96 hours. Upon completion of the exposure
period, the test specimens shall be
conditioned at ambient room conditions for 1
hour, after which the specified measurements
shall be performed.
(JIS C60068-2-1)
Appearance
異状なきこと
No Damage
Contact
Resistance
40 milliohms MAX.
4-3-7
湿
Humidity
コネクタを嵌合させ、40±2°C相対湿度
90~95 の雰囲気中に 96時間 放置後
取り出し、1時間 室温に放置する。
(JIS C60068-2-3/MIL-STD-202 試験法 103)
Mate connectors and expose to 40±2,
relative humidity 90 to 95% for 96 hours.
Upon completion of the exposure period,
the test specimens shall be conditioned
at ambient room conditions for 1 to 2 hours,
after which the specified measurements shall
be performed.
(JIS C60068-2-3/MIL-STD-202 Method 103)
Appearance
異状なきこと
No Damage
Contact
Resistance
40 milliohms MAX.
Insulation
Resistance
100 Megohm MIN.
Dielectric
Strength
4-1-3項満足のこと
Must meet 4-1-3
molex flcfixttfii
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TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
7 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-8
温度サイクル
Temperature
Cycling
コネクタを嵌合させ、 40±3°C 30分、
+105±2 30 これを1サイクルとし、
5サイクル 繰返す
但し、温度移行時間は 5分以内 とする
試験後12時間 室温に放置する。
(JIS C0025)
Mate connectors and subject to the following
conditions for 5 cycles. Upon completion of the
exposure period, the test specimens shall be
conditioned at ambient room conditions for 1 to
2hours, after which the specified
measurements shall be performed.
5 cycles of :
a) 40±3°C 30 minutes
b) + 105±2°C 30 minutes
(JIS C0025)
Appearance
異状なきこと
No Damage
Contact
Resistance
40 milliohms MAX.
4-3-9
Salt Spray
コネクタを嵌合させ、35±2°C にて 5±1%
重量比の塩水を 48±4時間噴霧し、試験後
常温で水洗いした後、室温で乾燥させる。
(JIS C60068-2-11/MIL-STD-202 試験法101)
Mate connectors and expose to the following
salt mist conditions. Upon completion of the
exposure period, salt deposits shall be removed
by a gentle wash or dip in running water, after
which the specified measurements shall be
performed.
NaCl solution
Concentration : 5±1 %
Spray time : 48±4 hours
Ambient temperature : 35±2
(JIS 60068-2-11/MIL-STD-202 Method 101)
Appearance
著しいサビの
なきこと。
No Damage
Contact
Resistance
40 milliohms MAX.
4-3-10
耐亜硫酸ガス
SO2 Gas
コネクタを嵌合させ、40±2°Cにて
50±5ppm亜硫酸ガス中に24時間放置する。
Mated connectors and expose to the conditions
of 50±5ppm SO2 gas ambient temperature
40±2 for 24 hours.
Appearance
異状なきこと
No Damage
Contact
Resistance
40 milliohms MAX.
molex Soldering bath method Soldering iron method flcfixttfii
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TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
8 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-11
耐アンモニア性
Ammonia gas
コネクタを嵌合させ、濃度28のアンモニ
ア水を入れた容器中に40分間放置する。
1Lに対して25Lの割合)
Mated connectors and expose to the
conditions of NH3 gas evaporating from
28% Ammonia solution for 40 minutes.
Appearance
割れ、ヒビ等の
破損なきこと
without damage
such as cracks or
other breaks
Contact
Resistance
40 milliohms
MAX.
4-3-12
半田付け性
Solderability
ターミナルまたはピンをフラックスに浸
し、本体の取付け基準面より1.6mm迄、245
±3℃の半田に3±0.5秒浸す。
Soldering Time : 3±0.5 sec.
Solder Temperature: 245±3
濡れ性
Solder
Wetting
浸漬面積の
90%以上
90% of immersed
area must show
no voids,pin
holes.
4-3-13
半田耐熱性
Resistance to
Soldering Heat
ディップの場合
Soldering bath method
ターミナルまたはピンを本体の取付け基
面より1.6mm迄、260±5の半田に5±0.5
秒浸す。
Soldering Time : 5±0.5 sec .
Solder Temperature: 260±5
Appearance
端子ガタ、割れ
異状なきこと
No Damage
(手半田時)
Soldering iron method
370400℃の半田ゴテにて
最大5秒加熱する。但し、端ピンに異常な
加圧のないこと
Solder Time : 5 sec. MAX.
Solder Temperature: 370400
However, without too much pressure to the
terminal pin
( ) :参考規格 Reference Standard
{ } :参考単位 Reference Unit
【5.外観形状、寸法及び材 PRODUCT SHAPE, DIMENSIONS AND MATERIALS
. 製品寸法 Dimensions of product
図面参照 Refer to the drawing.
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TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
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SEE SHEET 1 OF 15
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MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
9 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
【6.挿入力及び抜去力 INSERTION / WITHDRAWAL FORCE
※ロックを解除して測定 Released lock, and measure. { } :参考単 Reference Unit
No. of
CKT
単位
UNIT
挿入力(最大値
Insertion (MAX.)
抜去力(最小値
Withdrawal (MIN.)
初回
1st
6回目
6th
30回目
30th
初回
1st
6回目
6th
30回目
30th
2
N
{kgf}
6.5
{ 0.66 }
7.0
{ 0.72 }
11.0
{ 1.12 }
0.4
{ 0.04 }
0.4
{ 0.04 }
0.4
{ 0.04 }
3
N
{kgf}
9.7
{ 0.99 }
10.5
{ 1.07 }
15.1
{ 1.54 }
0.6
{ 0.06 }
0.6
{ 0.06 }
0.6
{ 0.06 }
4
N
{kgf}
12.9
{ 1.32 }
14.0
{ 1.43 }
18.3
{ 1.87 }
0.8
{ 0.08 }
0.8
{ 0.08 }
0.8
{ 0.08 }
5
N
{kgf}
16.2
{ 1.65 }
17.5
{ 1.79 }
21.8
{ 2.22 }
1.0
{ 0.10 }
1.0
{ 0.10 }
1.0
{ 0.10 }
6
N
{kgf}
19.4
{ 1.98 }
21.5
{ 2.20 }
24.8
{ 2.53 }
1.2
{ 0.12 }
1.2
{ 0.12 }
1.2
{ 0.12 }
7
N
{kgf}
22.6
{ 2.31 }
24.5
{ 2.50 }
28.6
{ 2.92 }
1.4
{ 0.14 }
1.4
{ 0.14 }
1.4
{ 0.14 }
8
N
{kgf}
25.9
{ 2.64 }
28.0
{ 2.86 }
32.3
{ 3.30 }
1.6
{ 0.16 }
1.6
{ 0.16 }
1.6
{ 0.16 }
9
N
{kgf}
29.1
{ 2.97 }
31.5
{ 3.22 }
35.9
{ 3.66 }
1.8
{ 0.18 }
1.8
{ 0.18 }
1.8
{ 0.18 }
10
N
{kgf}
32.3
{ 3.30 }
35.4
{ 3.61 }
39.4
{ 4.02 }
2.0
{ 0.20 }
2.0
{ 0.20 }
2.0
{ 0.20 }
11
N
{kgf}
35.6
{ 3.63 }
38.9
{ 3.97 }
42.9
{ 4.38 }
2.2
{ 0.22 }
2.2
{ 0.22 }
2.2
{ 0.22 }
12
N
{kgf}
38.8
{ 3.96 }
42.5
{ 4.33 }
46.3
{ 4.72 }
2.4
{ 0.24 }
2.4
{ 0.24 }
2.4
{ 0.24 }
13
N
{kgf}
42.0
{ 4.29 }
46.4
{ 4.73 }
49.6
{ 5.06 }
2.5
{ 0.26 }
2.5
{ 0.26 }
2.5
{ 0.26 }
14
N
{kgf}
45.3
{ 4.62 }
49.6
{ 5.06 }
52.8
{ 5.39 }
2.7
{ 0.28 }
2.7
{ 0.28 }
2.7
{ 0.28 }
15
N
{kgf}
48.5
{ 4.95 }
53.1
{ 5.42 }
56.6
{ 5.78 }
2.9
{ 0.30 }
2.9
{ 0.30 }
2.9
{ 0.30 }
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TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
10 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
【7.注記 NOTES
1.本製品のプラスチック部に黒点、気泡等が確認される場合や色合いが異なる場合(経年変化によるハウジング
の変色を含む)がありますが、製品性能に影響はありません。
There is no influence in the product performance though the black spot or bubble etc. might be confirmed to
the plastic part of this product and the shade might be different (discoloration by secular distortion etc.).
2.本製品は錫めっきを使用しているため、外観に摺動痕がつく場合が御座いますが、
製品性能に影響はありません
The wound of friction might adhere to externals because the tin plating is used for the tail and nail.
But there is no influence in the product performance.
3.本製品のハウジング及びメッキ表面に多少の傷が確認される場合がありますが、製品性能に問題ありません。
A few scratch may be confirmed to the surface of the housing and the plating of this product, however,
There is no problem in the product performance.
4.環境指令への適合 COMPLIANCE WITH ENVIRONMENTAL DIRECTIVE
ELV及びRoHS適合品
ELV and RoHS Compliant
5.本製品のプラスチック部に紫外線により変色する場合がありますが、製品性能に問題ありません。
Discoloration of the plastic part of this product can result from exposure to ultraviolet light.
There is no problem in the product performance.
6.梱包品の推奨保管条件を超えた場合は外観、半田付け性を確認の上ご使用下さい。
Please use it after confirming externals and soldering when the storage condition of packing goods is over
recommended storage condition.
molex flcfixttfii
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
11 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
【8.取り扱い上の注意事項 INSTRUCTION UPON USAGE
1. コネクタの詳細な取り扱いにつきましては、別紙 1.5 W/B CONN. SINGLE のコネクタ取り扱い説明
(AS-502578-001 本版、AS-502578-002 英語版)を参照して下さい。
Please refer to the manual of the 1.5 W/B connector. SINGLE series for the detailed handling of the connector.
(AS-502578-001 Jananese versionAS-502578-002 English version)
嵌合時にリセハウジングの矢印で示す部位を押し嵌合して下さい。
電線やハウジングのロック部を押した場合、これらが破損する恐れがありますのでお避け下さい。
Please push the part directed by FIG.1 at the time of mate.
It may damage, when electric wires or lock part of the receptacle housing are pushed.
1
FIG.1
コネクタの嵌合を取り外す際は、必ずロックを解除して行って下さい。
電線はまとめて軽くつかみ、指の平全体で、ロック解除用バーをロック保護壁と共に押して
ロックを解除し、ゆっくり引き抜いてください。
When unmated connectors, positive locks shall be released.
2.弊社の推奨基板パターン寸法を変更して設計を行なう際は、致命的な不良の原因にもなりますので
あらかじめご相談下さい。
In the case of changing our recommended board pattern size and designing, please consult in advance
because it may cause a fatal defect.
PUSH
PUSH
電線
WIRE
リセハウジング
REC. HOUSING
molex flcfixttfii
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
12 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
3.平坦度の実装性能は、実装基板の反りの影響を含まないものと致します。
Mounting performance of coplanarity shall not contain the influence of the warpage of the mounting board.
4.本品の平坦度保証につきましては、実装前での保証のみであり、空リフロー中および空リフロー後での
平坦度につきましては、保証の限りではありません。
The coplanarity assurance of this product is a guarantee alone before mounting, and the coplanarity during
and after the empty reflow is not guaranteed.
5.実装後において手半田コテによるリペアーを行なう際は、必ず仕様書掲載の条件以内で行なって下さい。
条件を超えて実施した場合、端子の抜け、接点ギャップの変化、モールドの変形、溶融等が原因により
破損の原因になります。
Please conduct it under the condition of the specifications when repairing by hand soldering iron after mounting.
In the case of practicing beyond the condition, the backlash, the change in the contact gap,
the deformation of the mold and the melting, etc. may cause a damage.
6.ディップ条件によっては端子メッキ部にヨリ等が発生する場合がありますが、製品性能には影響は
ございません。
Strand, etc. may be generated on the terminal plating part according to the dip condition, however,
there is no influence in the product performance.
7.ディップ条件によっては樹脂部に変色が発生する場合がありますが、製品性能には影響はございません。
Discoloration may be generated in the resin part according to the dip condition, however,
there is no influence in the product performance.
8.ディップ条件によっては色落ちする場合がありますので、あらかじめご確認下さい。
Color fall may be generated according to the dip condition, please consult in advance.
9.本製品をご使用時に取り付けられた電線・プリント基板の共振や、機器の回転構造や可動部分の動作により
コネクタ嵌合部(接点部)が常に動いてしまう状態での御使用は避けて下さい。接触部の摺動磨耗等による
接触不良の原因となります。 従って、機器内で電線・プリント基板を固定し、共振を抑える等の処置をお願
い致します。
Please do not use the connector in a condition where the wire, the printed circuit board, or the contact area is
experiencing a sympathetic vibration of wires and printed circuit board, and constant movement of devices.
This may cause a defect in the contact due to the contact area being worn down. Therefore, please fix wires
and printed circuit board on the chassis, and reduces sympathetic vibration.
10.基板実装前後に端子に触らないでください
Please do not touch the terminals before or after reflowing the connector onto the printed circuit board.
molex flcfixttfii
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
13 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
11.コネクタ嵌合状態で基板の持ち運び等コネクタに負荷が掛かる作業は行わないようにしてください。コネク
タ破損等の原因となる場合が有ります。
Please do not do work that the load hangs in the connector like the carrying of the substrate etc. with the
connector engages. There is a case where it causes the connector damage etc.
12.基板実装後に基板を直接積み重ねない様に注意してください。
Please do not stack the printed circuit board directly after mounted the connector on it.
13.半田こてによる手修正を行なう際、過度の半田やフラックスを使用しないで下さい田上がりやフラック
ス上がりにより接触、機能不良に至る場合があります。
When conducting manual repairs using a soldering iron, please do not use more solder and flux than needed.
This may cause solder wicking and flux wicking issues, and it will eventually cause a contact defect and
functional issues.
14.実装機によってコネクタに負荷が加わると変形、破損する場合がありますので事前にご確認下さい。
If there is accidental contact with the connector while it is going through the reflow machine, there may be
deformation or damage caused to the connector. Please check to prevent this.
15.コネクタのみで基板を支えることは避け、コネクタ以外での基板固定対策を行ってください。
Please do not use the connector alone to provide mechanical support for the printed circuit board (PCB). Please
ensure that there is a fixed structure on the phone chassis or other component support for the PCB.
16.嵌合後、コネクタピッチ方向、スパン方向及び回転方向への負荷がかかるような動作またはセットは
しないでください。コネクタ破壊やはんだクラックを引き起こします
After mated the connector, please do not allow the printed circuit boards to apply pressure on the connector in
either the pitch direction or the span direction. It may cause damage to the connector and may crack the
soldering.
17.本製品及び加工工程品(仕掛品)や加工品(ハーネス等)の梱包及び輸送・保管時にはコネクタに負荷が
加わらないようご注意下さい。変形、破損などの原因となり、コネクタの性能不良の原因となります。
Please try to prevent any external forces or shock from being applied to the connector while the cable assembly
is in process, when it is being packaged, or while it is in transportation. This may cause deformation and damage
to the connector and cause a defect in the products performance.
18.ハーネス加工品及びコネクタ嵌合後の電線の引き回しの際、引張りによる力が加わりますと、接点部、結線部
(圧着部)やロック部(端子ロック部)が損傷を受け、接触不良の原因となります。電線の引回し配線をされ
る場合、ネクタに無理な外力が加わらないように、線に緩みを持たせ、余裕を持たせる処置をして下さい。
The cable assembly should not have a constant stress or pulling force applied on it when it is in the mated
condition. This phenomenon may damage the contact area or wiring area (crimping).
Therefore, when designing the wire positioning, please ensure that there is enough length of wire to avoid stress
on the connector.
19.コネクタに適用できる電線は、原則として錫メッキつき付軟銅撚り線です。
その他の電線の使用については別途ご確認下さい
The applicable wire for this connector, in principle, is tin-plated copper stranded wire.
Please consult us and evaluate it in advance when using other wires.
molex 5025787“0' 502579—0‘00. 50342970000 flcfixttfii
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
14 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
20.プラグハウジング(502578-**0*)に端子(502579-0*00503429-0000)を挿入する際2に示した正規の方
向から端子が突き当たるまで挿入して下さい。又、挿入後軽く電線を引張って端子が抜け出さないか確認下さ
い。
When inserting the terminal (502579-0*00, 503429-0000) into the receptacle housing (502578-**0*),
please ensure that the terminal is inserted completely and touches the end of the receptacle housing. Please
insert the terminal in the correct direction as showing in figure 2. Also, please pull the wire lightly after inserting
the terminal to ensure that the terminal is fully inserted and can not be pulled out.
21.治具等を使用し、圧着端子を抜いた場合には、ランスが変形し強度が低下し端子を再装着後の
端子保持力が極端に低下します。そのため、圧着端子のリペアの際には新しいハウジングを
必ず使用して下さい。
When extracting a crimp terminal from the housing using a jig, it may deform the housing lance and therefore
reduce the terminal retention force after re-inserting of the terminal. Therefore, please ensure to use a new
housing after repairing the crimp terminals.
22.本製品をご使用時には、1PINりの定格以上の電流を複数の回路に分岐しての使用は避けて下さい。
When using this product, please ensure that the specification for rated current per circuit is followed. Do not
allow the sum of the current used on several circuits to exceed the maximum allowable current.
23.活電状態の電気回路で、挿入、抜去ができることを前提に作られていません
スパーク等による危険の発生、性能不良につながりますので、活電状態での挿入、抜去はしないで下さい。
This product is not designed for the mating and unmating of the connectors to be performed under the condition
of an active electrical circuit. It may cause a spark and product defect if the connectors are mated and unmated
in this way.
<図2 端子挿入方向>
PLUG TERMINAL
5025790*00, 503429-0000
<図3 端子装着状態>
502578-**0*
PLUG HOUSING
molex flcfixttfii
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
1.5mm PITCH WIRE TO BOARD CONNECTOR
SINGLE DIP TYPE
製品仕様書
K
SEE SHEET 1 OF 15
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-503159-001
FILE NAME
PS503159001
SHEET
15 OF 15
EN-037(2015-09 rev.4)
PRODUCT SPECIFICATION
REV.
REV. RECORD
DATE
ECN NO.
WRITTEN BY :
CHECKED BY :
A
RELEASED
'08/06/06
J2008-4162
N.NISHI
K.ASAKAWA
B
REVISED
'08/12/02
J2009-1431
S.KUROSE
K.ASAKAWA
C
REVISED
'09/02/17
J2009-1945
Y.GOTO
K.ASAKAWA
D
REVISED
'09/03/02
J2009-2005
Y.GOTO
K.ASAKAWA
E
REVISED
'09/03/18
J2009-2111
S.KUROSE
K.ASAKAWA
F
REVISED
'10/01/13
J2010-1339
N.ITO
K.ASAKAWA
G
REVISED
'10/04/28
J2010-2153
Y.GOTO
K.ASAKAWA
H
REVISED
'12/07/06
J2013-0026
R.HORI
K.ASAKAWA
J
REVISED
'13/02/26
J2013-0946
K.MATSUYAMA
K.ASAKAWA
K
REVISED
15/09/17
J2015-1447
T.AKAIKE
K.ASAKAWA

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