BU3087FV Datasheet by Rohm Semiconductor

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ssmKuNuucToR l ROHm L ( A ’ F1122 Rigs WWW ewewllm l Four kinds of Modulation-Rate is selectable (i0.25%/ i0.50“/e/ i0.75“/e/ i1.00“/e) I Triangular Modulation .Applications Digital-TV, STB, TV-Tuner .Typical Application Ci XOUT I A I CLKOUT ,0 0 van 1 I I I TEST '0 (Caution) CL and RD in Typical Applicalion Circuit should be optimized as OPmducl structure Silicon monolithic lntegraled oirouil OThis producl is not designed www.mhm.ccm , o 2012 ROHM co., Ltd. All rights reserved. 1/23 15222111 - 14‘ um
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays
1/23
Datashee
t
TSZ2211114001
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
www.rohm.com
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Built in VCXO,
Spread-Spectrum Clock Generator
BU3087FV
Description
BU3087FV has built in VCXO that is necessary for the
Digital-TV signal reception.
Connecting 27MHz crystal oscillator generates clock
signals to 74.25MHz for Hi-Vision.
BU3087FV has built in Spread-Spectrum function too.
Features
3225 size crystal is usable
ON / OFF of Spread-Spectrum is selectable
Four kinds of Modulation-Rate is selectable
(±0.25% / ±0.50% / ±0.75% / ±1.00%
Triangular Modulation
Applications
Digital-TV, STB, TV-Tuner
Key Specifications
Crystal Pullability ±105ppm (Typ.)
Modulation Frequency 34.5kHz (Typ.)
Cycle-to-Cycle Jitter 180psec (Typ.)
Operating Current 45mA (Typ.)
Operating Temperature -10 to +75
Package (Typ.) (Typ.) (Max.)
SSOP-B16 5.00mm x 6.40mm x 1.35mm
Typical Application Circuit
(Caution) CL and RD in Typical Application Circuit should be optimized as to using crystal and board condition.
SSOP-B16
3.3V (Typ.)
0.1μF
XIN
A
VDD1
A
VSS1
VCTRL
A
VDD2
A
VSS2
MODSEL1
MODSEL2
XOU
T
PDB
CLKOU
T
VD
D
VSS
SSON
TES
CLK27M
27MHz Crystal
CL CL
RD
0.1μF
0.1μF
Figure 1. Typical Application Circuit
CLKOUT VDD
2/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Block Diagram
7:MODSEL1
with Pull-up
10:TEST
with Pull-down
4:VCTRL
1:XIN
16:XOUT
14:CLKOUT
Spread-Spectrum
PLL
9:CLK27M
V
CXO
Control
Logic
15:PDB
with Pull-up
11:SSON
with Pull-up
8:MODSEL2
with Pull-down
Pin Configuration
Figure 2. Block Diagram
Figure 3.Pin Configuration (TOP VIEW)
XIN
A
VDD1
A
VSS1
VCTRL
A
VDD2
A
VSS2
MODSEL1
MODSEL2
XOU
T
PDB
CLKOU
T
VD
D
VSS
SSON
TES
T
CLK27M
1
2
3
4
5
6
7
8
16
15
14
14
12
11
10
9
3/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Pin Function
Table of Spread-Spectrum Modulation1Pin_XIN input frequency =27.000000MHz
In the case of 11Pin_SSON=H, outputs it according to the following table.
In the case of 11PinSSON=L, outputs unmodulated clock.
PIN No. PIN Name Function
1 XIN Crystal Input terminal
2 AVDD1 Power supply for VCXO
3 AVSS1 GND for VCXO
4 VCTRL VCXO control input terminal
5 AVDD2 Power supply for PLL-Analog
6 AVSS2 GND for PLL-Analog
7 MODSEL1
Spread-Spectrum Modulation control terminal
(Refer to Table of Spread-Spectrum Modulation)
with pull-up
8 MODSEL2
Spread-Spectrum Modulation control terminal
(Refer to Table of Spread-Spectrum Modulation)
with pull-down
9 CLK27M 27.000000MHz Output
10 TEST Test terminal, with pull-down
11 SSON Spread-Spectrum ONOFF choiceHONLOFF, with pull-up
12 VSS GND for PLL-Digital
13 VDD Power supply for PLL-Digital
14 CLKOUT 74.250000MHz Output
15 PDB Power-down control terminal, with pull-up
16 XOUT Crystal Output terminal
MODSEL2 MODSEL1 CLKOUT
L L 74.250000MHz ±0.25% Modulation
L H 74.250000MHz ±0.50% Modulation
H L 74.250000MHz ±0.75% Modulation
H H 74.250000MHz ±1.00% Modulation
4/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Absolute Maximum Ratings (Ta=25°C)
Parameter Symbol Ratings Unit
Supply voltage VDD -0.3 to 4.0 V
Input Voltage VIN -0.3 to VDD+0.3 V
Storage Temperature
range Tstg -55 to 125 °C
Power dissipation PD 6901 mW
1 A measure value at mounting on 70mm x 70mm x 1.6mm glass epoxy substrate.
In the case of exceeding Ta=25°C, 6.9mW should be reduced per 1°C.
Recommended Operating Ratings
Parameter Symbol Ratings Unit
Supply voltage VDD 3.135 to 3.465 V
Input ”H” Voltage VIH 0.8VDD to VDD V
Input ”L” Voltage VIL 0.0 to 0.2VDD V
Operating Temperature topr -10 to 75 °C
Frequency Control
Voltage Vc 0.0 to VDD V
Output load CL 15 (MAX) pF
1 In case of Output load exceeds previous value , consideration should be adapted Rise Time and Fall Time for condition of use.
DC Characteristics AC Characleristics
5/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Electrical Characteristics
DC Characteristics
(VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, at No Load, unless otherwise specified
Parameter Symbol Limit Unit Conditions
Min. Typ. Max.
Output H voltage VOH VDD-0.4 V IOH=4.0mA
Output L voltage VOL 0.4 V IOL=4.0mA
Operating
Circuit current IDD 45.0 58.0 mA
Output no load,
±0.50% Modulation
Input H current 1 IupH -1.5 1.5 μA PDB, SSON, MODSEL1 Terminal
VIH=VDD
Input H current 2 IdnH 35.0 70.0 105.5
μA MODSEL2, TEST Terminal,VIH=VDD
Input H current 3 IdirH -1.5 1.5
μA VCTRL Terminal,VIH=VDD
Input L current 1 IupL -105.5 -70.0 -35.0 μA PDB, SSON, MODSEL1 Terminal
VIL=0.0V
Input L current 2 IdnL -1.5 1.5
μA MODSEL2, TEST Terminal,VIL=0.0V
Input L current 3 IdirL -1.5 1.5
μA VCTRL Terminal,VIL=0.0V
CLKOUT CLKOUT 74.248144 74.250000 74.251856 MHz VCTRL=1/2VDD
Crystal Pullability fp ±80 ±105 ±130 ppm 0VCTRLVDD 1
Spread-Spectrum
Modulation Frequency Fmod 32.5 34.5 36.5 kHz Triangular Modulation,
Independently of Modulation Rate
1 This is a guarantee with only IC. It is finished with confirmation to operate with Crystal (DSX321G8pF load) made in DAISHINKU CORP.
AC Characteristics
(VDD=3.3V, Ta=25°C, Crystal Frequency=27.000000MHz, Output load=15pF, unless otherwise specified
Following the table cannot test directly on characteristic when shipment, so it is a design guarantee.
Parameter Symbol Limit Unit Conditions
Min. Typ. Max.
Duty Duty 45 50 55 % Measured at 1/2VDD
Jitter 1σ JsSD 35 psec Period Jitter 1σ2,
in Spread-Spectrum OFF
Jitter P-P JsABS 180 psec Period Jitter MIN-MAX value2,
in Spread-Spectrum OFF
Jitter
Cycle-to-Cycle JsCyCy 180 psec Cycle-to-Cycle Jitter,
In ±0.50% Modulation
Rise Time Tr 1.2 nsec Time between 0.2VDD and 0.8VDD
Fall Time Tf 0.7 nsec Time between 0.8VDD and 0.2VDD
Lock Up Time Tlock 1 msec 3
※2 Jitter means center value when using Japan Tektronix : TDS7104 Digital Phosphor Oscilloscope.
※3 Time between voltage supply leads to 3.135V and output clock gets stable.
Spread-Spectrum Modulation Waveform
Modulation Waveform is triangular. Modulation Rate is selectable among ±0.25%/±0.50%/±0.75%/±1.00%.
In addition, Modulation Frequency is 34.5kHz without depending on Modulation Rate.
( Figure 4 shows ±0.50% Modulation Waveform. )
74.250000MHz
74.250000MHz x (100 + 0.5)%
74.250000MHz x (100 - 0.5)%
Modulation Frequency34.5kHz
Figure 4. Spread-Spectrum Modulation Waveform
6/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum OFF setting)
TIME (5nsec/div.)
Figure 5. CLK27M Output Waveform
CLK27M
(
500mV/div.
)
TIME (1nsec/div.)
Figure 6. CLK27M Period-Jitter
CLK27M
(500mV/div.)
TIME (5nsec/div.)
Figure 7. CLKOUT Output Waveform
CLKOUT
(500mV/div.)
TIME (1nsec/div.)
Figure 8. CLKOUT Period-Jitter
CLKOUT
(500mV/div.)
7/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)
0
20
40
60
80
100
120
140
160
180
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Period-Jitter MIN-MAX : JsABS[psec]
Ta=25°C
Figure 9. CLK27M Period-Jitter MIN-MAX
0
20
40
60
80
100
120
140
160
180
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Period-Jitter MIN-MAX : JsABS[psec]
VDD=3.3V
Figure 10. CLK27M Period-Jitter MIN-MAX
45
46
47
48
49
50
51
52
53
54
55
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Duty : Duty[%]
VDD=3.3V
Figure 12. CLK27M Duty
Figure 11. CLK27M Duty
45
46
47
48
49
50
51
52
53
54
55
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Duty : Duty[%]
Ta=25°C
8/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Fall-Time : Tf[nsec]
VDD=3.3V
Figure 16. CLK27M Fall-Time
0.0
0.4
0.8
1.2
1.6
2.0
2.4
3.10 3.20 3.30 3.40 3.50
SUPPLY VOLTAGE : VDD[V]
Rise-Time : Tr[nsec]
Figure 13. CLK27M Rise-Time
Ta=25°C
0.0
0.4
0.8
1.2
1.6
2.0
2.4
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Rise-Time : Tr[nsec]
VDD=3.3V
Figure 14. CLK27M Rise-Time
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
3.10 3.20 3.30 3.40 3.50
SUPPLY VOLTAGE : VDD[V]
Fall-Time : Tf[nsec]
Figure 15. CLK27M Fall-Time
Ta=25°C
9/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)
0
40
80
120
160
200
240
280
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Period-Jitter MIN-MAX : JsABS[psec]
Ta=25°C
Figure 17. CLKOUT Period-Jitter MIN-MAX
0
40
80
120
160
200
240
280
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Period-Jitter MIN-MAX : JsABS[psec]
VDD=3.3V
Figure 18. CLKOUT Period-Jitter MIN-MAX
45
46
47
48
49
50
51
52
53
54
55
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Duty : Duty[%]
VDD=3.3V
Figure 20. CLKOUT Duty
45
46
47
48
49
50
51
52
53
54
55
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Duty : Duty[%]
Ta=25°C
Figure 19. CLKOUT Duty
10/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Performance Curves (Spread-Spectrum OFF setting, Output load=15pF)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Fall-Time : Tf[nsec]
VDD=3.3V
Figure 24. CLKOUT Fall-Time
0.0
0.4
0.8
1.2
1.6
2.0
2.4
3.10 3.20 3.30 3.40 3.50
SUPPLY VOLTAGE : VDD[V]
Rise-Time : Tr[nsec]
Figure 21. CLKOUT Rise-Time
Ta=25°C
0.0
0.4
0.8
1.2
1.6
2.0
2.4
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Rise-Time : Tr[nsec]
VDD=3.3V
Figure 22. CLKOUT Rise-Time
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
3.10 3.20 3.30 3.40 3.50
SUPPLY VOLTAGE : VDD[V]
Fall-Time : Tf[nsec]
Figure 23. CLKOUT Fall-Time
Ta=25°C
“L w x mm I m“ u I?“ M V W m
11/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum ON setting)
FREQUENCY (500kHz/div.)
Figure 25. CLKOUT±0.25% Modulation Spectrum
CLKOUT
(
10dB/div.
)
FREQUENCY (500kHz/div.)
Figure 27. CLKOUT±0.75% Modulation Spectrum
CLKOUT
(
10dB/div.
)
FREQUENCY (500kHz/div.)
Figure 28. CLKOUT±1.00% Modulation Spectrum
CLKOUT
(
10dB/div.
)
FREQUENCY (500kHz/div.)
Figure 26. CLKOUT±0.50% Modulation Spectrum
CLKOUT
(
10dB/div.
)
© 2012 ROHM 00., Ltd www.rohm,cam T8222111 ~15 - 001
12/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Wave Forms (VDD=3.3v, Ta=25°C, Spread-Spectrum ON setting)
CLKOUT (60psec/div.)
TIME (20μsec/div.)
Figure 29. CLKOUT±0.25% Modulation Waveform
TIME (20μsec/div.)
Figure 30. CLKOUT±0.50% Modulation Waveform
CLKOUT (78psec/div.)
TIME (20μsec/div.)
Figure 31. CLKOUT±0.75% Modulation Waveform
CLKOUT (93psec/div.)
TIME (20μsec/div.)
Figure 32. CLKOUT±1.00% Modulation Waveform
CLKOUT (113psec/div.)
13/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)
Modulation Frequency has a same characteristic despite a Modulation control.
Modulation Rate has a same trend despite a control.
32.5
33.0
33.5
34.0
34.5
35.0
35.5
36.0
36.5
3.10 3.20 3.30 3.40 3.50
SUPPLY VOLTAGE : VDD[V]
Modulation-Frequency : Fmod[kHz]
Figure 33. CLKOUT ±0.50% Modulation Frequency
Ta=25°C
32.5
33.0
33.5
34.0
34.5
35.0
35.5
36.0
36.5
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Modulation-Frequency : Fmod[kHz]
VDD=3.3V
Figure 34. CLKOUT ±0.50% Modulation Frequency
0.40
0.42
0.44
0.46
0.48
0.50
0.52
0.54
0.56
0.58
0.60
3.10 3.20 3.30 3.40 3.50
SUPPLY VOLTAGE : VDD[V]
Modulation-Rate [%]
Figure 35. CLKOUT ±0.50% Modulation Rate
Ta=25°C
0.40
0.42
0.44
0.46
0.48
0.50
0.52
0.54
0.56
0.58
0.60
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Modulation-Rate [%]
VDD=3.3V
Figure 36. CLKOUT ±0.50% Modulation Rate
14/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)
0
60
120
180
240
300
360
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Cycle-to-Cycle Jitter : JsCyCy[psec]
VDD=3.3V
Figure 40. CLKOUT ±0.50% Modulation
Cycle-to-Cycle Jitter
0
60
120
180
240
300
360
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Cycle-to-Cycle Jitter : JsCyCy[psec]
Ta=25°C
Figure 39. CLKOUT ±0.50% Modulation
Cycle-to-Cycle Jitter
0
60
120
180
240
300
360
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Cycle-to-Cycle Jitter : JsCyCy[psec]
Ta=25°C
Figure 37. CLKOUT ±0.25% Modulation
Cycle-to-Cycle Jitter
0
60
120
180
240
300
360
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Cycle-to-Cycle Jitter : JsCyCy[psec]
VDD=3.3V
Figure 38. CLKOUT ±0.25% Modulation
Cycle-to-Cycle Jitter
15/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)
0
60
120
180
240
300
360
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Cycle-to-Cycle Jitter : JsCyCy[psec]
VDD=3.3V
Figure 44. CLKOUT ±1.00% Modulation
Cycle-to-Cycle Jitter
0
60
120
180
240
300
360
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Cycle-to-Cycle Jitter : JsCyCy[psec]
Ta=25°C
Figure 43. CLKOUT ±1.00% Modulation
Cycle-to-Cycle Jitter
0
60
120
180
240
300
360
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Cycle-to-Cycle Jitter : JsCyCy[psec]
Ta=25°C
Figure 41. CLKOUT ±0.75% Modulation
Cycle-to-Cycle Jitter
0
60
120
180
240
300
360
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Cycle-to-Cycle Jitter : JsCyCy[psec]
VDD=3.3V
Figure 42. CLKOUT ±0.75% Modulation
Cycle-to-Cycle Jitter
16/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Performance Curves (Spread-Spectrum ON setting, Output load=15pF)
VCXO Crystal Pullability has been gathered from following the evaluation environment.
Evaluation board: 70mm x 70mm x 1.6mm, 4 layersFR-4
Using parts : 27MHz Crystal (DSX321G8pF load) made in DAISHINKU CORP. RD=200Ω, CL=4pF
VCXO Crystal Pullability modulates by a using crystal and a board condition.
In order to use, should be checked matting with a final board condition.
-160
-120
-80
-40
0
40
80
120
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
VCXO-Control-Voltage : Vctrl[V]
Crystal Pullability : fp[ppm]
VDD=3.3v, Ta=25°C
Figure 47. VCXO Crystal Pullability
40
44
48
52
56
60
3.1 3.2 3.3 3.4 3.5
SUPPLY VOLTAGE : VDD[V]
Operating Current : Icc[mA]
Ta=25°C
Figure 45. Operating Current
40
44
48
52
56
60
-20 0 20 40 60 80
AMBIENT TEMPERATURE : Ta[]
Operating Current : Icc[mA]
VDD=3.3V
Figure 46. Operating Current
CLKOUT VDD xom l 1' CLKOUT VDD % l I TEST
17/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
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j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Typical Application Circuit
In the case of Spread-Spectrum Modulation Rate =±0.75% setting, 7Pin_MODSEL1 connects GND, and 8Pin_MODSEL2
connect Power supply directly following the diagram.
In the case of other Modulation Rate setting, should be changed connections as a Table of Spread-Spectrum Modulation (P3).
(In the case of ±0.50% setting, it is no problem that 7Pin_MODSEL1 and 8Pin_MODSEL2 are OPEN Manages.)
In the case of Spread-Spectrum OFF setting, 11Pin_SSON connect GND directly as the following diagram.
(In the case of using Spread-Spectrum, it is no problem that 11Pin_SSON are OPEN Manages.)
Figure 48. Modulation Rate =±0.75% setting Typical Application Circuit
3.3V (Typ.)
0.1μF
XIN
A
VDD1
A
VSS1
VCTRL
A
VDD2
A
VSS2
MODSEL1
MODSEL2
XOU
T
PDB
CLKOU
T
VD
D
VSS
SSON
TES
CLK27M
27MHz Crystal
CL CL
RD
0.1μF
0.1μF
Figure 49. Spread-Spectrum OFF setting Typical Application Circuit
3.3V (Typ.)
0.1μF
XIN
A
VDD1
A
VSS1
VCTRL
A
VDD2
A
VSS2
MODSEL1
MODSEL2
XOU
T
PDB
CLKOU
T
VD
D
VSS
SSON
TES
CLK27M
27MHz Crystal
CL CL
RD
0.1μF
0.1μF
18/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Application Information
Basically, mount ICs to the printed circuit board for use.
(If the ICs are not mounted to the printed circuit board, the characteristics of ICs may not be fully demonstrated.)
Mount 0.1µF capacitors in the vicinity of the IC Pins between 2Pin_AVDD1, 3Pin_AVSS1, and 5Pin_AVDD2,
6Pin_AVSS2, and 12Pin_VSS, 13Pin_VDD respectively.
To obtain accurate frequency, confirm the Crystal-matching with the last board to get rid of a problem
by a mass-production.
Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power
supply and GND terminal.
For EMI protection, it is effective to put ferrite beads in the origin of power supply to be fed to BU3087FV from the
printed circuit board or to insert a capacitor (of 1Ω or less), which bypasses high frequency desired, between the power
supply and the GND terminal.
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring,
width of GND wiring, and routing of wiring.
Typical Application Circuit is recommendation, but in order to use, thoroughly check to be sure characteristic.
Power Dissipation
(SSOP-B16 package)
Figure 50. Power Dissipation Curve (Pd-Ta Curve)
* 70mm x 70mm x 1.6mm Glass Epoxy Board
0
100
200
300
400
500
600
700
0 25 50 75 100 125
AMBIENT TEMPERATURE : Ta []
POWER DISSIPATION : Pd [mW]
19/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
I/O Equivalence Circuit
Pin No. Equivalent Circuit
Schmitt-trigger Pin
7, 11, 15
( with Pull-Up )
8, 10
( with Pull-Down )
VCXO Control Input Pin
4
Clock Output Pin
9, 14
To IC inside
To IC inside
From IC inside
From IC inside
20/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
I/O Equivalence Circuit
Pin No. Equivalent Circuit
Crystal Input Pin
1
Crystal Output Pin
16
To IC inside
From IC inside
From IC inside
21/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
’:.7 g 1E2: /%%fi§%fififi/ Hee‘ 1pm acme! fluavmly Heads m we mu‘hp‘e m We mHHmum mm Dvecuun a! lead \ Part Number Marking LOT Number 1 PIN MARK www.mhmxzom © 2012 ROHM C 18222111 >15-
22/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Ordering Information
Physical Dimension Tape and Reel Information
Marking Diagram
B U 3 0 8 7 F V - E 2
Part Number Package
FV : SSOP-B16
Packaging and forming specification
E2: Embossed tape and reel
SSOP-B16(TOP VIEW)
3087F
Part Number Marking
LOT Numbe
r
1PIN MARK
(Unit : mm)
SSOP-B16
4.4±0.2
6.4±0.3
1.15±0.1
9
8
16
1
0.10
0.65
0.3Min.
5.0±0.2
0.22±0.1
0.15±0.1
0.1
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
23/23
Datasheet
Datasheet
BU3087FV
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
j
TSZ2211115001
TSZ02201-0E3E0J500040-1-2
17.AUG.2012 Rev.001
Revision History
Date Revision Changes
17.AUG.2012 001 New Release
Datasheet
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

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