Adhesives, Epoxies, Greases, Pastes

Results: 7
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Size / Dimension
Usable Temperature Range
Color
Thermal Conductivity
Features
Shelf Life
Storage/Refrigeration Temperature
TC3-1G
TC3-1G
HEAT SINK THERMAL COMPOUND
Chip Quik Inc.
214
In Stock
1 : ₩8,614.00000
Bulk
Bulk
Active
Silicone Compound
1 gram Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Gray
8.50W/m-K
-
60 Months
37°F ~ 77°F (3°C ~ 25°C)
TC3-10G
TC3-10G
HEAT SINK THERMAL COMPOUND
Chip Quik Inc.
487
In Stock
1 : ₩54,939.00000
Bulk
Bulk
Active
Silicone Compound
5cc Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Gray
8.50W/m-K
-
60 Months
37°F ~ 77°F (3°C ~ 25°C)
TC4-20G
TC4-20G
HEAT SINK THERMAL COMPOUND - DEE
Chip Quik Inc.
42
In Stock
1 : ₩80,144.00000
Bulk
Bulk
Active
Thermal Compound, Liquid Metal
20 gram Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Silver
79.00 W/m-K
-
60 Months
68°F ~ 77°F (20°C ~ 25°C)
TC4-1G
TC4-1G
HEAT SINK THERMAL COMPOUND - DEE
Chip Quik Inc.
19
In Stock
1 : ₩16,996.00000
Bulk
Bulk
Active
Thermal Compound, Liquid Metal
1 gram Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Silver
79.00 W/m-K
-
60 Months
68°F ~ 77°F (20°C ~ 25°C)
TC3-3.5G
TC3-3.5G
HEAT SINK THERMAL COMPOUND
Chip Quik Inc.
31
In Stock
1 : ₩21,643.00000
Bulk
Bulk
Active
Silicone Compound
3.5 gram Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Gray
8.50W/m-K
-
60 Months
37°F ~ 77°F (3°C ~ 25°C)
TC4-10G
TC4-10G
HEAT SINK THERMAL COMPOUND - DEE
Chip Quik Inc.
20
In Stock
1 : ₩48,367.00000
Bulk
Bulk
Active
Thermal Compound, Liquid Metal
10 gram Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Silver
79.00 W/m-K
-
60 Months
68°F ~ 77°F (20°C ~ 25°C)
TC4-2G
TC4-2G
HEAT SINK THERMAL COMPOUND - DEE
Chip Quik Inc.
5
In Stock
1 : ₩25,682.00000
Bulk
Bulk
Active
Thermal Compound, Liquid Metal
2 gram Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Silver
79.00 W/m-K
-
60 Months
68°F ~ 77°F (20°C ~ 25°C)
Showing
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Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.