Board Spacers, Stackers (Board to Board)

Results: 11
Packaging
BulkTray
Number of Positions
123458101216
Pitch
0.079" (2.00mm)0.100" (2.54mm)-
Number of Rows
12
Row Spacing
0.079" (2.00mm)-
Length - Overall Pin
0.512" (13.000mm)0.730" (18.542mm)0.945" (24.000mm)1.330" (33.782mm)1.425" (36.200mm)-
Length - Post (Mating)
0.085" (2.150mm)0.149" (3.785mm)0.321" (8.150mm)0.354" (8.992mm)0.471" (11.963mm)-
Length - Stack Height
0.343" (8.700mm)0.433" (11.000mm)0.472" (12.000mm)0.614" (15.596mm)0.750" (19.050mm)0.984" (25.000mm)-
Length - Tail
0.085" (2.150mm)0.110" (2.800mm)0.118" (3.000mm)0.120" (3.050mm)0.149" (3.785mm)-
Contact Finish - Post (Mating)
-GoldTin
Contact Finish Thickness - Post (Mating)
15.0µin (0.38µm)98.4µin (2.50µm)100.0µin (2.54µm)-
Stocking Options
Environmental Options
Media
Marketplace Product
11Results
Applied FiltersRemove All

Showing
of 11
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Number of Positions
Pitch
Number of Rows
Row Spacing
Length - Overall Pin
Length - Post (Mating)
Length - Stack Height
Length - Tail
Mounting Type
Termination
Contact Finish - Post (Mating)
Contact Finish Thickness - Post (Mating)
Color
0879370406
0879370406
CONN HDR 4POS 0.1 STACK T/H TIN
Molex
15,218
In Stock
1 : ₩449.00000
Bulk
Bulk
Active
4
0.100" (2.54mm)
1
-
0.730" (18.542mm)
0.149" (3.785mm)
0.433" (11.000mm)
0.149" (3.785mm)
Through Hole
Solder
Tin
100.0µin (2.54µm)
Black
879370800
0879370800
CONN HDR 8POS 0.1 STACK T/H TIN
Molex
11,039
In Stock
1 : ₩869.00000
Tray
Tray
Active
8
0.100" (2.54mm)
1
-
0.945" (24.000mm)
0.354" (8.992mm)
0.472" (12.000mm)
0.118" (3.000mm)
Through Hole
Solder
Tin
100.0µin (2.54µm)
Black
CONN HDR 5POS 0.1 STACK T/H TIN
0879370502
CONN HDR 5POS 0.1 STACK T/H TIN
Molex
0
In Stock
Check Lead Time
9,600 : ₩278.55927
Bulk
Bulk
Active
5
0.100" (2.54mm)
1
-
0.730" (18.542mm)
0.149" (3.785mm)
0.433" (11.000mm)
0.149" (3.785mm)
Through Hole
Solder
Tin
100.0µin (2.54µm)
Black
CONN HDR 3POS 0.1 STACK T/H
0879370301
CONN HDR 3POS 0.1 STACK T/H
Molex
0
In Stock
Check Lead Time
9,600 : ₩316.15219
Bulk
Bulk
Active
3
0.100" (2.54mm)
1
-
-
-
-
-
Through Hole
Solder
-
-
Black
CONN HDR 12POS 0.1 STACK T/H TIN
0879371206
CONN HDR 12POS 0.1 STACK T/H TIN
Molex
0
In Stock
Check Lead Time
1,800 : ₩579.32944
Bulk
Bulk
Active
12
0.100" (2.54mm)
1
-
0.730" (18.542mm)
0.149" (3.785mm)
0.433" (11.000mm)
0.149" (3.785mm)
Through Hole
Solder
Tin
100.0µin (2.54µm)
Black
CONN HDR 16POS 0.1 STACK T/H TIN
0879371602
CONN HDR 16POS 0.1 STACK T/H TIN
Molex
0
In Stock
Check Lead Time
3,000 : ₩1,964.68500
Bulk
Bulk
Active
16
0.100" (2.54mm)
1
-
0.512" (13.000mm)
0.085" (2.150mm)
0.343" (8.700mm)
0.085" (2.150mm)
Through Hole
Solder
Tin
100.0µin (2.54µm)
Black
CONN HDR 16POS 0.1 STACK T/H
0879371601
CONN HDR 16POS 0.1 STACK T/H
Molex
0
In Stock
Check Lead Time
300 : ₩3,043.74667
Bulk
Bulk
Active
16
0.100" (2.54mm)
1
-
1.330" (33.782mm)
0.471" (11.963mm)
0.750" (19.050mm)
0.110" (2.800mm)
Through Hole
Solder
Gold
15.0µin (0.38µm)
Black
CONN HDR 1POS STACK T/H TIN
0879370106
CONN HDR 1POS STACK T/H TIN
Molex
0
In Stock
Active
Tray
Active
1
-
1
-
0.730" (18.542mm)
0.149" (3.785mm)
0.433" (11.000mm)
0.149" (3.785mm)
Through Hole
Solder
Tin
100.0µin (2.54µm)
Black
CONN HDR 8POS 0.1 STACK T/H TIN
0879370802
CONN HDR 8POS 0.1 STACK T/H TIN
Molex
0
In Stock
Active
Bulk
Active
8
0.100" (2.54mm)
1
-
0.730" (18.542mm)
0.149" (3.785mm)
0.433" (11.000mm)
0.149" (3.785mm)
Through Hole
Solder
Tin
100.0µin (2.54µm)
Black
CGRID SINGLE ROW HDR DUAL WFR T/
0879370203
CGRID SINGLE ROW HDR DUAL WFR T/
Molex
0
In Stock
Active
Bulk
Active
2
0.079" (2.00mm)
2
0.079" (2.00mm)
-
-
0.614" (15.596mm)
-
Through Hole
Solder
Tin
98.4µin (2.50µm)
Black
CGRID HDR SRDW TH .38AULF 10CKTS
0879371000
CGRID HDR SRDW TH .38AULF 10CKTS
Molex
0
In Stock
Active
Bulk
Active
10
0.100" (2.54mm)
1
-
1.425" (36.200mm)
0.321" (8.150mm)
0.984" (25.000mm)
0.120" (3.050mm)
Through Hole
Solder
Gold
15.0µin (0.38µm)
Black
Showing
of 11

Board Spacers, Stackers (Board to Board)


Rectangular header type connectors are designed to connect circuits on one PCB to circuits on another providing insulation and board spacing. They are selected by pitch (distance between pin centers), stack height, and the number of positions and rows. They are typically soldered in place, with surface mount and through-hole versions available in gold, tin and tin-lead options.